事业介绍
事业领域
Vertical Probe Card
  • 使用垂直型Probe,用于检查一般Type Pad或Ball Type Pad的产品
  • 适合测试高难度和高集成度的半导体的产品(Logic IC、Application Process、PMIC、RF)
  • 适合测试WLCSP Type Test的产品(BGA、Cu-Pillar、Etc)
  • 垂直型Probe
  • 高难度 / 高集成度
  • WLCSP Type
Application Process Chip用
01. Direct Docking
Item Specifications
Pin Count 10,000 ~ 30,000
DUT 2 ~ 8
Pitch 90㎛
PCB V93K / T2000
MLC Size 101 x 101㎜
02. Ultra Flex 18 inch
Item Specifications
Pin Count 50,000
DUT 6
Pitch 150㎛
PCB 18“ U-Flex
MLC Size 101 x 101㎜
Logic IC用
Item Specifications Remark
Probe Diameter 63um  
Scrub Mark Size ≤15um 3mil OD
Probe Force 2.0gf/mil  
Max. Over Drive 150um (Rec. 75um)
Min. Pad Pitch 130um  
Life Time <1M T/D  
Operation Temp. -40 ~ 125℃  
Max Current 1A  
Contact Resistance <5Ω  
Leakage <10nA 3sec settling time
Fine Pitch Logic IC用
Item Specifications Remark
Probe Diameter 30um  
Scrub Mark Size ≤10um 2.5mil OD
Probe Force 0.7gf/mil  
Max. Over Drive 100um (Rec. 50um)
Min. Pad Pitch 50um  
Life Time <1M T/D  
Operation Temp. -40 ~ 125℃  
Max Current ≤400mA  
Hybrid (Wafer & Package)用
Item Specifications Remark
Probe Diameter 63um, 200um Cobra & Pogo Pin
Scrub Mark Size ≤15um 3mil OD
Probe Force 2.0gf/mil  
Max. Over Drive 150um (Rec. 75um)
Min. Pad Pitch 150um  
Life Time <1M T/D  
Operation Temp. -40 ~ 125℃  
Max Current 1A  
Low-Leakage用
Item Specifications Remark
Probe Diameter 10um  
Scrub Mark Size ≤15um 3mil OD
Probe Force 2.0gf/mil  
Max. Over Drive 100um (Rec. 75um)
Min. Pad Pitch 70um  
Life Time <1M T/D  
Operation Temp. -40 ~ 125℃  
Max Current <400mA  
Leakage <300fA 3sec settling time
DDI & FT用
Item Specifications Remark
Probe Diameter 70um~ Custom
Scrub Mark Size ≤15um 3mil OD
Probe Force 2.0gf/mil  
Max Over Drive 80um (Rec. 20um)
Min. Pad Pitch 80um  
Life Time <1M T/D  
Operation Temp. -40 ~125℃  
Max Current <400mA  
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