본문
Hybrid (Wafer & Package)
TEPS, Hybrid (Wafer & Package)
| Probe Diameter | 63um, 200um |
|---|---|
| Scrub Mark Size | ≤15um |
| Probe Force | 2.0gf/mil |
| Drawing |
| Item | Specifications | Remark |
| Probe Diameter | 63um, 200um |
Cobra & Pogo Pin |
| Scrub Mark Size | ≤15um |
3mil OD |
| Probe Force | 2.0gf/mil | |
| Max.Over Drive | 150um |
(Rec. 75um) |
| Min. Pad Pitch | 150um |
|
| Life Time | <1M T/D |
|
| Operation Temp. | -40 ~125℃ | |
| Max. Current | 1A |