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Hybrid (Wafer & Package)
TEPS, Hybrid (Wafer & Package)
Probe Diameter | 63um, 200um |
---|---|
Scrub Mark Size | ≤15um |
Probe Force | 2.0gf/mil |
Drawing |
Item | Specifications | Remark |
Probe Diameter | 63um, 200um |
Cobra & Pogo Pin |
Scrub Mark Size | ≤15um |
3mil OD |
Probe Force | 2.0gf/mil | |
Max.Over Drive | 150um |
(Rec. 75um) |
Min. Pad Pitch | 150um |
|
Life Time | <1M T/D |
|
Operation Temp. | -40 ~125℃ | |
Max. Current | 1A |