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Application Process Chip
Logic IC
Hybrid
Low-Leakage
Cantilever
HBM
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KOR
|
ENG
|
CHN
PRODUCTS
Application
Process Chip
Logic IC
Hybrid
Low-Leakage
Cantilever
HBM
Space Transformer
Probe Head
Logic IC
2
Logic IC
.
Probe Diameter
: 63um
.
Scrub Mark Size
: ≤15um
.
Probe Force
: 2.0gf/mil
1
Fine Pitch Logic IC
.
Probe Diameter
: 30um
.
Scrub Mark Size
: ≤10um
.
Probe Force
: 0.7gf/mil
1st floor, 26-43, Dongtangongwon-ro 1-gil, Hwaseong-si, Gyeonggi-do, Republic of Korea / Postal Code : 18436
T.
+82-31-613-6970
F.
+82-31-613-6938
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